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Pad Topography, Contact Area and Hydrodynamic Lubrication in Chemical-Mechanical Polishing
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1157 / 2009
- Published online by Cambridge University Press:
- 31 January 2011, 1157-E01-02
- Print publication:
- 2009
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Experimental Investigation and Numerical Simulation of Pad Stain Formation during Copper CMP
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- Journal:
- MRS Online Proceedings Library Archive / Volume 991 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0991-C06-02
- Print publication:
- 2007
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CMP Active Diamond Characterization and Conditioner Wear
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- Journal:
- MRS Online Proceedings Library Archive / Volume 991 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0991-C01-01
- Print publication:
- 2007
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Investigation of Diamond Grit Size and Conditioning Force Effect on CMP Pads Topography
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- Journal:
- MRS Online Proceedings Library Archive / Volume 991 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0991-C01-07
- Print publication:
- 2007
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A Predictive Model for Controlling Wafer Level Polish Rate Uniformity in Oxide CMP
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- Journal:
- MRS Online Proceedings Library Archive / Volume 867 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, W5.3
- Print publication:
- 2005
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